NC254 has been developed to offer extremely broad process windows for printing, wetting and pin probe testing. The superior wetting ability of NC254 results in bright, smooth, shiny, solder joints. NC254 offers very low post process residues, which...

NC257-2 has been developed to offer extremely broad process windows for printing, wetting and pin-probe testing. NC257-2 produces bright, smooth and shiny solder joints and very clear, low volume post soldering residue. NC257-2 was developed for use in...

NC258 has been developed to offer long pause-to-print capabilities while enhancing fine print definitions. NC258 reduces voiding. The superior wetting ability of NC258 results in bright, smooth and shiny solder joints. It also offers very low post...

An evolution of the highly successful NC258 platform, M8 brings no-clean solder paste performance to the next level. Developed in combination with T4 and finer mesh leaded and lead-free alloy powders, M8 provides stable transfer efficiencies required for...

An evolution of the highly successful NC258 platform, M8 brings no-clean solder paste performance to the next level. Developed in combination with T4 and finer mesh leaded and lead-free alloy powders, M8 provides stable transfer efficiencies required for...

NC257MD solder paste has been specifically designed for the MyData MY500 Jet Printer. Its unique rheological properties were engineered and validated through extensive testing to provide continuous and consistent deposits. Clear pin-probe testable...

NC257MD solder paste has been specifically developed for Mycronic Jet Printers. Its unique rheological properties were engineered and validated through extensive testing in collaboration with Mycronic to provide continuous and consistent deposits...

AIM’s NC259 solder paste has been developed for use with no/low-silver alloys while retaining the performance of high-silver SAC alloys. NC259 demonstrates pause-to-print capabilities >8 hours while providing high transfer efficiency and precise...

AIM’s NC259 solder paste has been developed for use with no/low-silver alloys while retaining the performance of high-silver SAC alloys. NC259 demonstrates pause-to-print capabilities >8 hours while providing high transfer efficiency and precise print...

AIM’s NC259 solder paste has been developed for use with no/low-silver alloys while retaining the performance of high-silver SAC alloys. NC259 demonstrates pause-to-print capabilities >8 hours while providing high transfer efficiency and precise...

AIM's WS488 water soluble solder paste has been designed to wet virtually any solderable electronic surfaces, components, assemblies, and substrates. WS488 offers superior slump resistance, as well as excellent print characteristics and 8 hours of...

AIM's WS488 water soluble solder paste has been designed to wet virtually any solderable electronic surfaces, components, assemblies, and substrates. WS488 offers superior slump resistance, as well as excellent print characteristics and 8 hours of...

AIM's WS488 water soluble solder paste has been designed to wet virtually any solderable electronic surfaces, components, assemblies, and substrates. WS488 offers superior slump resistance, as well as excellent print characteristics and 8 hours of...

AIM's WS488 water soluble solder paste has been designed to wet virtually any solderable electronic surfaces, components, assemblies, and substrates. WS488 offers superior slump resistance, as well as excellent print characteristics and 8 hours of...

An evolution of the highly successful NC258 platform, M8 brings no-clean solder paste performance to the next level. Developed in combination with T4 and finer mesh leaded and lead-free alloy powders, M8 provides stable transfer efficiencies required for...

An evolution of the highly successful NC258 platform, M8 brings no-clean solder paste performance to the next level. Developed in combination with T4 and finer mesh leaded and lead-free alloy powders, M8 provides stable transfer efficiencies required for...

NC258 has been developed to offer long pause-to-print capabilities while enhancing fine print definitions. NC258 reduces voiding. The superior wetting ability of NC258 results in bright, smooth and shiny solder joints. It also offers very low post...

NC258 has been developed to offer long pause-to-print capabilities while enhancing fine print definitions. NC258 reduces voiding. The superior wetting ability of NC258 results in bright, smooth and shiny solder joints. It also offers very low post...

NC258 has been developed to offer long pause-to-print capabilities while enhancing fine print definitions. NC258 reduces voiding. The superior wetting ability of NC258 results in bright, smooth and shiny solder joints. It also offers very low post...

NC258 has been developed to offer long pause-to-print capabilities while enhancing fine print definitions. NC258 reduces voiding. The superior wetting ability of NC258 results in bright, smooth and shiny solder joints. It also offers very low post...