NC275 is a VOC-free, water-based no-clean liquid flux formulated to offer a very wide process window for lead-free and tin-lead wave soldering operations. NC275 offers faster wetting for SN100C and SAC alloys than previously formulated fluxes and is...

Common Flux Thinner is a solvent that is used to thin Water Soluble, No Clean and RMA fluxes in foaming and some spray applications. Common Flux Thinner is typically used in conjunction with the AIM n.020 Titration Kit. Use of Common Flux Thinner is...

NC254 has been developed to offer extremely broad process windows for printing, wetting and pin probe testing. The superior wetting ability of NC254 results in bright, smooth, shiny, solder joints. NC254 offers very low post process residues, which...

NC257-2 has been developed to offer extremely broad process windows for printing, wetting and pin-probe testing. NC257-2 produces bright, smooth and shiny solder joints and very clear, low volume post soldering residue. NC257-2 was developed for use in...

NC258 has been developed to offer long pause-to-print capabilities while enhancing fine print definitions. NC258 reduces voiding. The superior wetting ability of NC258 results in bright, smooth and shiny solder joints. It also offers very low post...

NC Paste Flux is a no clean tacky/rework flux designed to wet virtually all solderable electronic surfaces, components, assemblies, and substrates. AIM NC Paste Flux may be used for general touch up or rework of printed circuit boards, and for attaching...

NC Paste Flux is a no clean tacky/rework flux designed to wet virtually all solderable electronic surfaces, components, assemblies, and substrates. AIM NC Paste Flux may be used for general touch up or rework of printed circuit boards, and for attaching...

Mixing spatula for solder paste.

An evolution of the highly successful NC258 platform, M8 brings no-clean solder paste performance to the next level. Developed in combination with T4 and finer mesh leaded and lead-free alloy powders, M8 provides stable transfer efficiencies required for...

An evolution of the highly successful NC258 platform, M8 brings no-clean solder paste performance to the next level. Developed in combination with T4 and finer mesh leaded and lead-free alloy powders, M8 provides stable transfer efficiencies required for...

DEOX Powder, Solder Pot Dross Reducer, 10 LB Bag

Sn63Pb37 Electropure is a high purity alloy that is composed of 63 percent tin and 37 percent lead. Electropure is alloyed in a proprietary method that results in a low drossing, high wetting solder. The Electropure process reduces suspended oxides in...

AU80SN20, Solid Wire Solder, (No Flux), .015 dia, 1 Ft Rod

ITW Chemtronics has included all the cleaning supplies necessary for a successful fusion splice and 2.5mm fiber optic connection in these convenient kits. The FTTP Fiber Optic Cleaning Kit contains one aerosol of Electro-Wash PX Precision Fiber Optic...

NC257MD solder paste has been specifically designed for the MyData MY500 Jet Printer. Its unique rheological properties were engineered and validated through extensive testing to provide continuous and consistent deposits. Clear pin-probe testable...

NC257MD solder paste has been specifically developed for Mycronic Jet Printers. Its unique rheological properties were engineered and validated through extensive testing in collaboration with Mycronic to provide continuous and consistent deposits...