89088 | SN100C Lead Free, NC259 NoClean Solder Paste, T4 - 500g Jar

Product Description

AIM’s NC259 solder paste has been developed for use with no/low-silver alloys while retaining the performance of high-silver SAC alloys. NC259 demonstrates pause-to-print capabilities >8 hours while providing high transfer efficiency and precise print definition. The NC259 activator system promotes wetting even in the absence of silver and tolerates peak reflow temperatures as high as 260C. When combined with SN100C, NC259 produces bright, smooth solder joints and exhibits low voiding on both BGA and BTC packages.|Technical Info|