Product Description
An evolution of the highly successful NC258 platform, M8 brings no-clean solder paste performance to the next level. Developed in combination with T4 and finer mesh leaded and lead-free alloy powders, M8 provides stable transfer efficiencies required for todays UFP and umBGA devices, reducing DPMO on the most challenging applications. A novel activator system provides powerful, durable wetting action accommodating a wide range of profiling processes and techniques. M8 activators will reduce wetting related defects such as HiP (head-in-pillow) and provide smooth shiny joints.|Technical Info|
Product Videos
Custom Field
Lead Free / Leaded Leaded
Alloy SN63
Flux Type No-Clean
Particle Size T4
Container 500g Jar
